铜粉导电胶的研究  

Research on copper powder conductive adhesive

作　　者：汤宇 曹建强 

机构地区：[1]苏州市胶粘剂厂有限公司,江苏苏州205021

出　　处：《粘接》2014年第11期78-80,共3页Adhesion

摘　　要：用铜粉、环氧树脂、改性胺类固化剂、硅烷偶联剂、奇士增韧剂、稀释剂等制备铜粉导电胶。比较了铜粉的粒径及添加量、铜粉表面处理、导电胶基料、固化时间等对导电性能的影响,并对导电胶性能进行测试,最终选定最合适的导电胶配方。We prepared a copper powder conductive adhesive with copper powder, epoxy resin, modified amine curing agent,coupling reagent KH-560,Sunkist toughener,thinner,etc.Our laboratory evaluated the effects on the conductive properties of the particle size,and amount of cupper powder,copper surface treatment,substrate and curing time.We tested the conductive adhesive performance and finally determined the better conductive adhesive formulation.

关 键 词：导电胶 铜粉 改性环氧 改性固化剂 

分 类 号：TM24[一般工业技术—材料科学与工程]