Carisolv Ⅲ化学机械去龋法对牙本质黏结强度影响研究  

Effects of Carisolv Ⅲ caries removal method on dentin bonding strength.

作　　者：朱晓华[1] 邵丽娜[1] 仇丽鸿[1] 詹福良[1] 

机构地区：[1]中国医科大学口腔医学院牙体牙髓病科,沈阳110002

出　　处：《中国实用口腔科杂志》2014年第10期621-624,共4页Chinese Journal of Practical Stomatology

基　　金：中国医科大学口腔医学院青年科研启动基金(K101593-14-44)

摘　　要：目的探讨化学机械去龋制剂CarisolvⅢ对牙本质黏结强度的影响。方法收集2014年3—6月在中国医科大学口腔医学院口腔颌面外科门诊因各种原因拔除的龋坏恒磨牙40颗,将每颗牙齿沿龋洞中心纵剖为两部分(即为两组,每组40个样本)。CarisolvⅢ去龋组:采用CarisolvⅢ化学机械法去龋;机械去腐组:采用慢速球钻去龋。将两组再各自随机均分为两组,分别用3M ESPE自酸蚀黏结剂和Adper Single Bond 2全酸蚀黏结剂黏结,然后用3M Z350光固化复合树脂分层充填。制作各样本的微拉伸试件,测试微拉伸黏结强度并进行比较分析。结果CarisolvⅢ去龋组的微拉伸黏结强度:采用3M ESPE自酸蚀黏结系统为(19.50±6.83)MPa,采用Adper Single Bond 2全酸蚀黏结系统为(24.35±7.97)MPa。机械去腐组的微拉伸黏结强度:采用3M ESPE自酸蚀黏结系统为(18.10±7.55)MPa,采用Adper Single Bond 2全酸蚀黏结系统为(23.50±8.33)MPa。采用相同黏结系统的两种去龋方法的微拉伸黏结强度比较,差异无统计学意义(P>0.05);而同一种去龋法,采用Adper Single Bond 2全酸蚀黏结系统的微拉伸黏结强度高于3M ESPE自酸蚀黏结系统,差异有统计学意义(P<0.05)。结论 CarisolvⅢ化学机械去龋法能够获得与机械去腐法同样的牙本质黏结强度。Abstract： Objective To study the effects of Carisolv Ⅲ caries removal method on micro-tensile bond strength of resin fillings to the carity dentin. Methods The study was carried out in School of Stomatology, China Medical University from March to June 2014. Forty extracted human molars with caries were used. Each molar was split into two parts, one part was prepared by Carisolv Ⅲ and the other part was prepared by the low-speed burs. For each group, the samples were randomly divided into two sub-groups. One was treated with 3M ESPE and restored with 3M Z350 rensin. The other group was treated with Single Bond 2 and restored with 3M Z350 rensin. MTBS of the two adhesive systems were tested. Results The MTBS of the two adhensive systems were（ 19.50 ± 6.83）MPa and （24.35 ± 7.97）MPa in Carisolv Ⅲ group, treated with 3M ESPE and Single Bond 2, respectively, and （18.10 ± 7.55）MPa and （23.50 ± 8.33）MPa in burs group. There was no significant difference in MTBS between Carisolv Ⅲ group and bur group. Conclusion Carisolv caries shows the same MTBS as the traditional removal method by burs.

关 键 词：CARISOLV 微拉伸 化学机械去龋 

分 类 号：R78[医药卫生—口腔医学]