高导热环氧少胶云母带的制备及性能研究  

Preparation and Properties of High Thermal Conductivity Epoxy Dry Mica Tape

作　　者：李忠良[1] 黄友根[1] 李鸿岩[1] 

机构地区：[1]株洲时代新材料科技股份有限公司,湖南株洲412007

出　　处：《绝缘材料》2014年第6期36-38,42,共4页Insulating Materials

摘　　要：通过分析分别填充Al2O3、Al N和BN对胶黏剂导热系数和电气性能的影响,筛选出Al N作为胶粘剂的导热填料,并分析Al N添加量对胶粘剂导热系数的影响。结果表明:Al N添加质量分数为60%时,胶粘剂的导热系数为0.26 W/(m·K),制备的高导热云母带导热系数为0.35 W/(m·K),与普通云母带TJ5442-1相比,其导热系数是普通云母带的1.8倍,其它性能接近,能够满足电机绝缘结构的技术要求。The effects of filling Al2O3, AlN, and BN to adhesive respectively on the thermal conductivityand electrical properties of the adhesive were studied, and the AlN was selected as conductive filler, thenthe effect of AlN addition amount on the thermal conductivity of the adhesive was analyzed. The resultsshow that when the AlN addition amount is 60%（mass fraction）, the thermal conductivity of the adhesiveis 0.26 W/（m·K）, and the thermal conductivity of the prepared high conductive mica tape is 0.35 W/（m·K）, which is 1.8 times as high as the ordinary mica tape TJ5442-1, and the other properties are close,which can satisfy the requirements of motor insulation structure.

关 键 词：高导热 少胶云母带 导热系数 填料 ALN 

分 类 号：TM215.5[一般工业技术—材料科学与工程]