用一维金刚石制备氧化铝基复合陶瓷基板  

Feasibility of fabricating Al_2O_3 composite substrate with one-dimensional diamond

作　　者：王双喜[1] 刘高山[1] 叶家星[1] 张丹[1] 胡梦夏 

机构地区：[1]汕头大学工学院,汕头515000

出　　处：《金刚石与磨料磨具工程》2014年第5期42-46,共5页Diamond & Abrasives Engineering

基　　金：广东省教育厅人才引进专项资金(2012B1033);汕头大学科研启动基金(NTF12001);汕头市科技计划项目(20B-1)

摘　　要：晶须或纤维是材料补强增韧的有效原料,近年来一直是新材料研究的热点,目前,主要的品种包括碳纤维、SiC晶须、钛酸铝晶须、氧化铝晶须等。传统的Al2O3或AlN低温共烧复合基板,由于玻璃等烧结助剂的加入,陶瓷基板可以实现在900℃以下的温度烧结,但基板导热率也由于玻璃的加入而显著降低。研究表明:高导热的纤维在复合材料中相互搭接形成三维导热网络,可以显著增加复合材料的热导率。金刚石是世界上导热性能最好的材料,本研究探讨了采用一维金刚石作为导热高速网络材料制备金刚石-氧化铝陶瓷基板的可行性。Whisker or fiber is an efficacious kind of reinforcing material for composite. The research about whisker or fiber has been a hot focus in recent years. Nowadays, the main kinds of onedimensional material include carbon fiber, SiC whisker, aluminium titanate whisker, alumina whisker, et al. The traditional LTCC substrates of Al2O3 or A1N with glass sintering additives could be sintered under 900℃ ,but at the same time the thermal conductivity of substrates reduces radically because of adding the glass additives. Experiment results showed that fiber with high thermal conductivity could lap together to form a three-dimensional heat conduction net which would increase thermal conductivity of composite greatly. Diamond is the best material for heat conduction. The feasibility of fabricating high heat conduction Al2O3 composite substrate with one-dimensional diamond network was discussed in this paper.

关 键 词：晶须 纤维 热导率 金刚石 陶瓷基板 

分 类 号：TQ164[化学工程—高温制品工业] TN305.94[电子电信—物理电子学]