玻璃/铝多层结构间阳极键合机理及界面微观分析  

Anodic bonding mechanism of glass/aluminum multilayer structure and microstructure analysis of bonded interface

作　　者：秦会峰[1] 孟庆森[2] 胡利芳[2] 

机构地区：[1]山西机电职业技术学院材料工程系,山西长治046100 [2]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《兵器材料科学与工程》2014年第6期39-42,共4页Ordnance Material Science and Engineering

基　　金：国家自然科学基金资助项目(50375015)

摘　　要：采用阳极键合法对玻璃/铝多层结构层间连接进行试验,通过SEM、EDS分析玻璃/铝多层结构键合界面的显微组织。结果表明:对连接接头进行拉伸试验时,断裂发生在玻璃基体中,这表明键合界面的结合强度高于玻璃基体;界面由过渡层组成,且过渡层元素呈梯度分布,过渡区主要为Al2Si O5复合氧化物。分析认为键合界面处复合氧化物Al2Si O5的形成是实现玻璃/铝界面连接的主要原因。Anodic bonding of borosilicate glass/aluminum multilayer structure was achieved. The tensile test of the bonded joint shows that the origin of crack is from the interior of the glass,indicating that the strength of the bonded interface is stronger than the glass strength. The microstructure of the bonding interface was analyzed by SEM and EDS. It indicates that the transition zone is generaed at the bonded interface. The transition zone is mainly consisted of composite oxides Al2SiO5. The bonded interface at the transition zone results from the formation of Al2SiO5.

关 键 词：阳极键合 硼硅玻璃 铝 界面 

分 类 号：TG453[金属学及工艺—焊接]