TSV制程关键工艺设备技术及发展  

A Review on TSV Key-equipment Technologies and Development

作　　者：魏红军[1] 段晋胜[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2014年第5期7-10,18,共5页Equipment for Electronic Products Manufacturing

摘　　要：论述了TSV技术发展面临的设备问题,并重点介绍了深硅刻蚀、CVD/PVD沉积、电镀铜填充、晶圆减薄、晶圆键合等几种制约我国TSV技术发展的关键设备。The problems are introduced about TSV equipment technologies in this paper briefly. Key-equipment are focused on the DR/E. CVD/PVD, copper filling.wafer thin. wafer bonding,which is restricting in TSV technology development in our country.

关 键 词：硅通孔 关键设备 铜填充 

分 类 号：TN305[电子电信—物理电子学]