锡渣的形成特点和减少措施  

Formation Characteristics and Reduction Measures of Solder Dross in Lead-free Wave Soldering

作　　者：韩彬[1,2] 檀正东 杜君宽 王海明 邓映柳 杜彬 史建卫 

机构地区：[1]深圳市艾贝特电子科技有限公司,广东深圳518103 [2]哈尔滨工业大学深圳研究生院,广东深圳518055 [3]中国电器科学研究院有限公司,广东广州510300

出　　处：《电子工业专用设备》2014年第9期46-52,共7页Equipment for Electronic Products Manufacturing

摘　　要：随着无铅钎料的广泛使用,波峰焊过程将产生更多的锡渣,造成生产成本增加。通过对其分布特点的研究,将锡炉熔融钎料表面氧化物分为A^E5个氧化物区,并分析了各区域氧化物的特点,列举了几种减少氧化渣的办法,分析了他们的实用性。As the lead-free solders are used widely, m ore solder dross was form ed during wave soldering,which lead to industrial waste.In this paper,according to the distribution rules,the oxide area on the surface offusing solder in the potis divided into five oxide area AE.The characteristic of each area of oxide is analyzed. Some methods to reduce dross were enum erated and their practicability was analyzed.

关 键 词：无铅波峰焊 锡渣 还原剂 锡渣分离机 

分 类 号：TN606[电子电信—电路与系统]