基于UV-LIGA工艺的酸性电铸铜溶液最优化配比  

The Optimal Ratio of Acid Copper Electroforming Solution Based on UV-LIGA Process

作　　者：南雪莉[1] 张斌珍[1] 张少华[1] 韩帅[1] 毛静[1] 

机构地区：[1]中北大学电子测试技术重点实验室和仪器科学与动态测试教育部重点实验室,太原030051

出　　处：《科学技术与工程》2014年第29期265-270,共6页Science Technology and Engineering

基　　金：863计划项目(2013AA041109)资助

摘　　要：为了获得镀层平整、致密的金属铜结构,经过反复实验研究获得了电铸铜溶液的最优化配比。首先采用UV-LIGA工艺制作出SU-8胶膜微结构,其次以此光刻固化后的结构作为模具,进行电铸试验。通过对电镀参数的反复调整,获得效果最优的镀液配比分别为:CuSO4·5H2O的质量浓度为180 g/L,98%的H2SO4为70 g/L,纯度为37%的HCl是0.188 mL/L,光亮剂210A、210B、210C分别为0.4 mL/L、0.3 mL/L、4 mL/L。实验结果表明,电铸获得的模具镜面光亮、无分界、质量高。同时,对电镀方法进行了改进,选择在常温下进行电铸实验并加入超声波完成辅助机械处理,得到了高纯度的电铸铜层,铜的重量百分比达到了96.22%,铸层表面显微组织结构明显改善,大大改良了电铸层的力学性能及物理性能。In order to obtain a copper structure with excellent throwing power and improved leveling characteristics,the optimized formulation of acid copper plating solution has became the key problem.UV-LIGA technology was used to produce a SU-8 cellophane microstructure.Lithography molding structurewas also used as a mold to conduct electroplating experiment.Through repeated adjustment of electroplating parameters,the optimal ratio of plating solution was achieved,respectively as follows：180 g/L Copper（Ⅱ） sulfate pentahydrate、70 g/L 98％ sulfate、0.188 mL/L 37％ hydrochloric acid、0.4 mL/L 210A brightener、0.3 mL/L 210B brightener、4 mL/L 210C brightener.The experimental results show that the electroforming mould have a bright mirror,no boundary,and a high quality.At the same time,to improve the plating method,ultrasonic was added for auxiliary machinery processing at room temperature,only to found that the high purity copper layer to be obtained.The weight of copper reached 96.22 percent.Cast structure of surface layer microstructure has also improved significantly,which greatly improved the mechanical properties and physical properties of electroforming layer.

关 键 词：UV-LIGA工艺 光亮酸性电铸铜 最优配比 超声处理 常温 

分 类 号：TQ153.44[化学工程—电化学工业]