PEO-LiClO_4与铝阳极键合界面结构及力学性能  

Structure and Mechanical Property of the Anodic Bonding Interface Between PEO-LiClO_4 and Al

作　　者：南粤 刘翠荣[1] 阴旭[1] 孟庆森[2] 杜超[1] 赵为刚[1] 

机构地区：[1]太原科技大学研究生学院,太原030124 [2]太原理工大学材料科学与工程学院,太原030024

出　　处：《微纳电子技术》2014年第12期798-802,共5页Micronanoelectronic Technology

基　　金：国家自然基金资助项目(51275332);太原科技大学大学生创新训练计划资助项目(2012018)

摘　　要：利用自制的阳极键合炉实现了PEO-LiClO4与铝的阳极键合,并且采用扫描电子显微镜(SEM)对键合界面进行了观察。结果表明,键合后铝/高分子固体电解质界面处生成了一层厚度约5μm的过渡层,分析认为该过渡层是两者得以焊合的关键。由实验得到的电流-时间的变化过程可以看出,键合区域中的导电离子是由瞬时高密度迁移转向低密度稳态迁移的。利用非线性有限元分析软件MSC.Marc研究了阳极键合件从90℃冷却到室温的残余应力和变形,并且建立了接头应力分析模型,探讨了界面应力场的分布规律,为提高键合质量提供了理论依据。对比翘曲变形前后的形状可知,试件从高温冷却后,上表面中心会向下收缩,边缘的翘曲下降,最大的翘曲发生在试件对角棱线处。模拟分析显示过渡层上等效应力是最大的,因此该层成为阳极键合接头中的薄弱部位。因此,对残余应力和变形进行分析并在此基础上提出缓解的措施是提高阳极键合性能的一个有效途径。The anodic bonding of PEO-LiC1O4 and A1 was realized by the home-made anodic bon- ding furnace, and the bonding interface was observed by the scanning electron microscope （SEM）. The result shows that a 5 μm-thickness transition layer after bonding is generated in the A1/solid polymer electrolyte interface, and the analysis suggests that the transition layer is the key to weld the both. The conducting ion in the bonding area is migrated from the instantaneous high density to low density steady-state by the current-time change process. The residual stress and deformation of the anodie bonding test piece cooled from 90 ℃ to room temperature were studied by the nonlinear finite element analysis software MSC. Marc, then the joint stress analysis model was establishd, and the distribution regularity of the interface stress field was discussed,providing the theoretical basis to improve the bonding quality. The comparison of the shapes before and after the buckling deformation shows that after the test piece cooled from the high temperature, the center of the upper surface shrinks down, the buckling of the edge decreases and the largest buckling occurs along the diagonal ridge of the test piece. The simulation analysis shows that the equivalent stress of the transition layer is the largest, so this layer becomes the weak part of the anodic bonding joint. Therefore, analyzing the residual stress and deformation and then proposing mitigation measures on this basis is an effective way to improve the perfor- mance of anodic bonding.

关 键 词：阳极键合 扫描电子显微镜(SEM) 高分子固体电解质(SPE) 残余应力 过渡层 MSC.Marc 

分 类 号：TN305.96[电子电信—物理电子学]