第一壁材料W/Cu界面设计与制备研究现状  

Current status of design and manufacture on W/Cu interface of the fist wall material

作　　者：罗来马[1,2] 谭晓月 罗广南[3] 昝祥[1,2] 朱晓勇[1] 吴玉程[1,2] 

机构地区：[1]合肥工业大学材料科学与工程学院,合肥230009 [2]安徽省有色金属材料与加工工程实验室,合肥230009 [3]中国科学院等离子体物理研究所,合肥230031

出　　处：《核聚变与等离子体物理》2014年第4期340-347,共8页Nuclear Fusion and Plasma Physics

基　　金：国家磁约束核聚变能发展研究专项(2014GB121001;2010GB109004);国家自然科学基金资助项目(51204064)

摘　　要：介绍了目前解决W/Cu连接界面缓解热应力的方法——添加适配层。在对不同适配层进行分析后,选出最佳W/Cu适配层,再对W/Cu适配层进行结构优化分析,得出选用W/Cu功能梯度材料作为适配层具有足够的结合强度,而且良好的导热性能能有效地缓解热应力。此外,重点阐述了目前成功的制备的W/Cu功能梯度材料用作W/Cu第一壁材料的适配层的常用方法。最后,对W/Cu功能梯度材料用作适配层解决W/Cu第一壁材料连接界面的问题做出了总结和展望。This paper reviews the current method of solving the W/Cu interface connection and relieving the thermal stress by added adaptation layer. After analyzing the different adaptation layer, the best W/Cu adaptation layer is selected, and then the W/Cu layer structure optimization analysis is conducted. The results show that using W/Cu functionally graded materials as the combination of the adaptation layer has enough strength, and good thermal conductivity are more effective to alleviate thermal stress. In addition, this paper expounds the current method which utilizes the successfully prepared W/Cu functionally gradient materials as W/Cu adaptation layer used in the first wall materials. Finally, this paper has made the summary and prospect about that the functionally gradient materials of W/Cu used as the adaptation layer to solve the first wall material W/Cu interface connection.

关 键 词：第一壁材料 适配层 界面特性 钨铜梯度材料 

分 类 号：TG146.1[一般工业技术—材料科学与工程]