Ti／Ni／Pt／Ni阻耐焊金属化体系的Au—Sn焊料凸点研究  

Study on Au- Sn Solder Bumps with Ti/Ni/Pt/Ni Barrier Metallization System

作　　者：李林森[1] 汪涛[1] 童洋[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2014年第3期33-36,共4页Hybrid Microelectronics Technology

摘　　要：本文研究并开发出一种用于倒装芯片焊接的同质共晶Au—Sn焊料凸点。位于焊料凸点底部的金属化膜系结构包括一层粘附层Ti和复合阻耐焊浸润层Ni／Pt／Ni。焊料层是由一连串的相互交叠的Au层和Sn层构成，该焊料凸点可以经历多次无钎剂回流循环。在焊料的制备时，即由于Au层在Sn层中的扩散，已经产生了若干相，正是由于这种相导致并加剧了回流时产生类共晶相和共晶δ、ζ相。该研究成果在系统级封装（SiP）中极具应用前景。A homogeneous mehing eutectic Au/Sn solder bump for flip - chip application has been developed. The bottom of bump metallization consists of Ti adhesion layer and composite barrier Ni/Pt/Niwetting layer. The solder layer composed of a se- quence of ahemating Au and Sn layers. The bump can be subjected to multiple fluxless reflow cycles. During the preparation of the solder, as Au layer spreads into Sn layer, a phase is formed in the process which results in eutecticlike phase and eutectic δ and ζ phases. The Au/Sn solder bumps have broad application？ prospects for system in package （SIP）.

关 键 词：薄膜 金锡 焊料凸点 金属化体系 

分 类 号：TG42[金属学及工艺—焊接]