玻璃浆料键合气密性研究  

Research on glass paste bonding air tightness

作　　者：喻兰芳[1,2] 梁庭[1,2] 熊继军[1,2] 崔海波[1,2] 王心心[1,2] 王涛龙 

机构地区：[1]中北大学仪器科学与动态测试教育部重点实验室,山西太原030051 [2]中北大学电子测试技术国防科技重点实验室,山西太原030051

出　　处：《传感器与微系统》2015年第1期34-35,39,共3页Transducer and Microsystem Technologies

基　　金：国家自然科学基金资助项目(51075375);国家重点基础研究发展计划("973"计划)资助项目(2010CB334703)

摘　　要：研究玻璃浆料真空封装MEMS器件工艺,由于玻璃浆料键合工艺条件控制较为复杂,键合不当易失败漏气。利用光学显微镜、超声显微镜、激光显微镜、电镜等多种显微镜对各阶段玻璃浆料的形貌进行观察,对由印刷方式、预处理条件和键合工艺对键合气密性的影响进行了分析。提出了影响玻璃浆料键合气密性的几个原因,对玻璃浆料键合工艺条件控制有非常重要的指导意义。Research on glass paste vacuum packaging MEMS device technology, because control condition of glass paste bonding process is relatively complex, improper bonding easily lead to leakage. Using a variety of microscopy ： optical microscopy, ultrasound microscopy, laser microscopy, electron microscopy to observe on various stages of glass paste morphology, analyze on effect of printing way, pretreatment conditions, and bonding process on air tightness of bonding. Several influential factors of air tightness of bonding are proposed, which has a very important guiding significance for controlling glass paste bonding process conditions.

关 键 词：玻璃浆料键合 印刷方式 预处理条件 键合工艺 气密性 

分 类 号：TN212[电子电信—物理电子学]