水杨酸体系抛光液中钌的化学机械抛光研究  

Chemical Mechanical Polishing of Ruthenium in Salicylic Acid System Slurry

作　　者：王婕[1] 储向峰[1] 董永平[1] 白林山[1] 叶明富[1] 孙文起[1] 

机构地区：[1]安徽工业大学,安徽马鞍山243002

出　　处：《稀有金属材料与工程》2014年第12期3120-3123,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金项目(50975002);安徽工业大学创新团队项目(TD201204);教育部高校留学回国人员科研项目

摘　　要：研究了抛光液中H2O2和水杨酸浓度对钌的抛光速率的影响。采用电化学方法和X射线光电子能谱分析了H2O2和水杨酸对金属钌腐蚀效果的影响;采用原子力显微镜观察钌表面的微观形貌。结果表明:水杨酸浓度的增加有利于金属钌表面钝化膜的形成,抛光速率值随之增加;随着H2O2浓度的不断增加,抛光速率不断增加,当H2O2质量分数大于3%时,抛光速率值随浓度的增加而降低。抛光后的金属钌表面平均粗糙度Ra为7.2 nm。The effect of concentrations of hydrogen peroxide （H2O2） and salicylic acid （SA） on the material removal rate （MRR） in slurries was investigated. The influence of H2O2 and SA on the corrosion behavior was studied by electrochemical methods and X-ray photoelectron spectroscopy （XPS）. The surface roughness of the polished Ru disk was characterized by atomic force microscopy （AFM）. The results show that the increase of SA promotes formation of passive film, and increases the MRR of Ru. MRR increases with the increasing of H2O2 at the beginning, but it would decrease when the concentration of H202 is higher than 3%. The surface roughness Ra of the polished Ru surface could reach 7.2nm.

关 键 词：钌 化学机械抛光 水杨酸 

分 类 号：TG175[金属学及工艺—金属表面处理]