Cu,Ag,Ni掺杂TiB_2基涂层的结构及韧性研究  

Microstructure and Toughness of TiB_2 Based Coatings with Cu,Ag and Ni Doped

作　　者：王怀勇[1,2] 李胜祗[1] 郭军[2] 王博[2] 朱萍[2] 黄峰[2] 

机构地区：[1]安徽工业大学材料学院,安徽马鞍山243002 [2]中国科学院宁波材料技术与工程研究所,浙江宁波315201

出　　处：《材料工程》2014年第12期79-85,共7页Journal of Materials Engineering

摘　　要：采用磁控溅射方法分别掺杂含量约为10%(原子分数)的Cu,Ag,Ni金属,制备出三种TiB2基涂层。利用XRD,SEM分析涂层结构,并通过塑性指数δH、划痕和压痕三种手段对涂层韧性进行表征。结果表明:掺杂金属在涂层中的存在形式不同,导致对涂层晶粒和生长结构的影响不同,其中Ag以晶体形式存在,未发现Cu和Ni的晶相;三种涂层均存在TiB2晶相,Ni和Ag使TiB2晶粒细化,Cu促进晶粒长大;TiB2-Cu和TiB2-Ni涂层为柱状结构,表面存在明显颗粒,而TiB2-Ag涂层柱状结构趋于消失,表面无明显颗粒。结构的不同对涂层的力学性能有明显影响,所有涂层均保持在较高的硬度(>35GPa),三种金属都对涂层韧性有所改善,其中Ni最为显著,Cu和Ag相对较差。Magnetron co-sputtering method was used to prepare TiB2 based coatings with about 10%（atom fraction） metal （Cu, Ag, Ni） doped. The microstructure of coatings was analyzed by X-ray dif- fraction （XRD） and scanning electron microscopy （SEM）. Three methods including plastic parameter 8H, scratching and indentation test were used for the toughness characterization. The results show that： three metals exhibite different effects on TiB2 grain size and growth structure due to their differ- ent forms of existence in the coatings. In detail, Ag exists as crystals, while Cu and Ni are amor- phous; TiB2 grains exist in all coatings, Ni and Ag inhibit grain growth, while Cu promotes; TiB2-Cu and TiB2-Ni coatings present a columnar structure with grains embedded in the surface, and TiB2-Ag coating tends to be column-free without grains. Moreover, these differences on the structure have ob- viously influence on the mechanical properties. All the coatings remain a high hardness （〉35GPa）. As compared with pure TiB2 coating,the toughness of three coatings improves with metals doped, the coating with Ni doped is more effective on the improvement of toughness than that with Cu and Ag.

关 键 词：磁控溅射 TiB2-Ni TiB2-Cu TiB2-Ag 划痕 韧性 

分 类 号：O484[理学—固体物理]