单片晶圆兆声清洗的仿真模型研究  

Study on Simulation Model of Single-wafer Megasonic Cleaning

作　　者：朱亚安 段瑜[1,2] 宋立媛[1,2] 孙琪艳[1,2] 殷艳娥 杨炜平 万锐敏[1,2] 季华夏 

机构地区：[1]云南北方奥雷德光电科技股份有限公司,云南昆明650223 [2]昆明物理研究所,云南昆明650223

出　　处：《红外技术》2015年第1期48-53,共6页Infrared Technology

基　　金：云南省应用基础研究重点项目;编号:2012FA004

摘　　要：通过研究单片晶圆兆声清洗过程中兆声头在晶圆表面的运动轨迹和能量积累过程,构建了单晶圆清洗的兆声能量分布和颗粒去除过程的数学模型。通过Mathematica 9.0对模型进行了运算和简化,经过离散化处理后,运用MATLAB对几种硅片转速和兆声臂转速的组合在硅片上的能量分布和颗粒分布进行了模拟仿真。发现简单组合比例下清洗效果与转速比例和清洗轨迹复杂程度密切相关,而固定半径扫描可以使能量分布更均匀,减少局部能量集中对晶圆IC的破坏,并且可以缩短清洗时间。A mode for calculating the distribution of megasonic energy and the process of particles cleaning is demonstrated by studying the distribution of megasonic energy and motion trail of megasonic arm in the single wafer. The model is simplified by Mathematica 9.0 and simulated by MATLAB under different rotation speed ratios, which indicates that the cleaning effect is closely related to the rotation speed and the motion trail of megasonic arm. Meantime, the distribution of megasonic energy becomes more uniformity by fixing the scanning radius, which also could reduce the damage to IC and the process time.

关 键 词：单片晶圆 兆声清洗 仿真模型 

分 类 号：TH132[机械工程—机械制造及自动化]