多次提拉法涂胶工艺及其过程仿真  

Numerical Simulation and Experiment of Dip Coating

作　　者：张琼[1] 李木军[1] 沈连婠[1] 叶回春[1] 谢俊舰 

机构地区：[1]中国科学技术大学精密机械与精密仪器系,安徽合肥230026

出　　处：《新技术新工艺》2015年第1期37-39,共3页New Technology & New Process

基　　金：国家自然科学基金资助项目(50905173)

摘　　要：为在圆柱基底上制备一定厚度的均匀光刻胶膜层,进行了提拉法涂胶试验,并结合试验建立了数值模型,模拟仿真了不同工况下的液膜轮廓,仿真计算得到的膜厚与试验结果有很好的一致性。仿真计算与试验结果表明,其提接速度越快,胶层厚度越大,膜层厚度均匀性随速度的增大而变差。膜层厚度与均匀性的这种变化特征使单次提拉法的应用范围有很大的局限性。针对此问题,进一步研究了多次提拉法涂胶,并在圆柱体基底上得到了较厚且较均匀的胶膜层。To obtain a certain thickness of uniform photoresist film, the dip coating process was numerically simulated and experimented with a particular emphasis on finding the free surface location at different velocities. Favorable agreement was obtained between computational results and experimental results. It turns out that film thickness increases with with- drawal velocity. It was also found that the uniformity of the photoresist film on the short rod gets worse with the increase of the withdrawal velocity. Considering the defect of large withdrawal velocity in thickness uniformity, multiple dip coating method was adopted to obtain a uniform and relatively thick film on a finite-length rod.

关 键 词：提拉法涂胶 多次涂胶 膜厚均匀性 数值仿真 

分 类 号：TN305.2[电子电信—物理电子学]