自动点胶技术在功率模块快速封装中的应用  

Application in the Power Module of Rapid Package Basing on the Technology of Automatic Adhesive Injecting

作　　者：项罗毅 

机构地区：[1]常州瑞华电力电子器件有限公司,江苏常州213200

出　　处：《装备制造技术》2015年第1期175-178,共4页Equipment Manufacturing Technology

摘　　要：本世纪初,伴随着步进电机应用于数字控制系统中,自动点胶技术也得到了快速发展,由于具有响应时间短、控制精度高、维护简单等优点,因此能够应用到了功率模块快速封装工艺中。重点介绍了自动点胶技术的原理及其在小功率模块封装上应用的工艺过程,并通过试验对比论证其工艺优势。At the beginning of this century,the technology of automatic adhesive injecting has developed rapidly with the stepper motor used in the digital control system.Because it has the advantages of fast response,high control accuracy,simple maintenance and so forth.So it can be applied to the power module fast packaging process.This paper mainly introduces the process principle of automatic dispensing technology and its application in the small power module package,and to demonstrate the technology advantage through contrast test.

关 键 词：功率模块 封装 自动点胶技术 

分 类 号：TN405[电子电信—微电子学与固体电子学]