薄壁镁合金手机后盖压铸工艺的数值模拟  

Numerical Simulation of Die-casting Parameters About Magnesium Alloy Thin-walled Phone Cover

作　　者：张欢欢[1] 康永林[1] 周冰[1] 祁明凡 朱国明[1] 李扬德 李卫荣 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]广东东莞宜安科技股份有限公司,广东东莞523662

出　　处：《热加工工艺》2015年第1期56-58,62,共4页Hot Working Technology

基　　金：国家973计划项目(2011CB606302-1);国家863计划项目(2013AA031001)

摘　　要：运用专业铸造软件Pro CAST对镁合金AZ91D薄壁手机盖压铸件的充型和凝固过程进行数值模拟分析,以铸件凝固后存在于铸件中的缩孔缩松的总和为标准,研究浇注温度、压射速度和模具温度等工艺参数对压铸件质量的影响。获得较优的压铸工艺参数,为提高镁合金手机盖的压铸质量提供依据。模拟结果表明:手机盖压铸件最小缺陷的压铸工艺参数是:浇注温度650℃,模具温度220℃和压射速度2.5 m/s。依据优化后的参数进行压铸试验,压铸件质量良好。The numerical simulation of filling and solidifying process of magnesium alloy AZ91D thin-walled phone cover die casting was performed with professional software ProCAST. The sum of porosity existing in the die casting was taken as standard. The influence of pouring temperatures, mold temperatures and injection speeds on the quality of the die casting were analyzed. The better technological parameters were acquired, which can provide basis for improving the quality of magnesium alloy phone cover .The results show that the optimum condition is as follows： pouting temperature of 650 ℃, mold temperature of 220 ℃, injection speed of 2.5 m/s. According to the optimum condition, the quality of the actual casting is well.

关 键 词：镁合金 压铸 数值模拟 缩孔缩松 

分 类 号：TG249.2[金属学及工艺—铸造]