高密度组装电子设备冷却技术应用研究  

Application Research of Cooling Technique on High Density Assembly Electronic Equipment

作　　者：田沣[1] 张娅妮[1] 邸兰萍[1] 张丰华[1] 

机构地区：[1]中航工业西安航空计算技术研究所,西安710065

出　　处：《电子与封装》2014年第11期1-4,20,共5页Electronics & Packaging

基　　金：航空科学基金(20100231)

摘　　要：随着现代飞机性能的不断提高,电子设备的性能也大幅提升。与此同时,电子设备的组装密度越来越高,导致其热管理问题更加突出。针对高密度组装电子设备冷却散热技术面临的主要问题,从传热原理、冷却结构以及设计方法等诸多方面着手,探讨了从芯片级、模块级到设备级的有效冷却散热方式,对各种冷却散热方式的基本原理、优缺点以及适用范围进行了研究对比。在传统冷却散热技术的基础上,对新型冷却散热技术的发展趋势作出了展望,为未来电子设备冷却散热技术发展指明了方向。Assembly density of electronic equipment becomes higher and higher as advancing of airplane performance which induces outstanding problems of thermal management. Aiming at cooling problems which high-density-assembly electronic equipment faced, efifcient cooling methods from chip, module to equipment are discussed in the paper. Basic principles, merits and drawbacks as well as scope of application about all cooling methods mentioned above are studied and compared. Finally, expectation about future cooling technique development trend of electronic equipment is provided.

关 键 词：高密度组装 电子设备 冷却技术 

分 类 号：TN305.94[电子电信—物理电子学]