高耐热高耐焊性环氧胶膜的研制  

Preparation of High Heat Resistance and Solder Resistance Epoxy Adhesive Film

作　　者：邵康宸[1] 李会录[1] 韩江凌[1] 魏弘利[1] 韩萌[1] 

机构地区：[1]西安科技大学材料科学与工程学院,西安710054

出　　处：《绝缘材料》2015年第2期16-19,共4页Insulating Materials

基　　金：国家自然科学基金资助项目(21204072)

摘　　要：以双酚A型环氧树脂EP638、EP828为基体树脂,丁腈橡胶为增韧剂,酰肼为固化剂,咪唑为固化促进剂,引入导热填料氮化硼、氧化铝,制备了高耐热高耐焊性环氧胶膜。采用单因素试验法优选出制备环氧胶膜的最佳工艺条件,对环氧胶膜的导热性能、介电性能、剪切强度、粘结强度和玻璃化转变温度(Tg)等进行测试。结果表明:制备高耐热高耐焊性环氧胶膜的最佳工艺条件是:m(EP638)∶m(EP828)=1∶1;w(丁腈橡胶)=20%,w(酰肼)=10%,w(咪唑)=5‰,w(填料)=60%,m(A12O3)∶m(BN)=1∶1;固化条件为120℃/1 h+150℃/1 h。此时环氧胶膜的介电常数为5.66,导热系数为0.581 W/(m·K),粘结强度为36.99 MPa,Tg为174.77℃,耐浸焊时间达10 min。We prepared a high heat resistance and solder resistance epoxy adhesive film using bisphenolA type epoxy resin EP638 and EP828 as matrix resin, nitrile rubber as toughening agent, hydrazide ascuring agent, imidazole as curing catalyst, and adding thermal conductive fillers boron nitride and alumina.The optimum process condition to prepare the epoxy adhesive film was optimized by single factorexperiment method, and its thermal conductivity, dielectric property, shear strength, bonding strength andglass transition temperature（Tg） were tested. The results show that the optimum process condition is thatthe mass ratio between EP638 and EP828 is 1∶1, the mass fraction of nitrile rubber is 20%, the massfraction of hydrazide is 10%, the mass fraction of imidazole is 5‰, the mass fraction of fillers is 60%,the mass ratio between A12O3 and BN is 1∶1, and the curing condition is “120 ℃/1 h ＋ 150 ℃/1 h”.While, the dielectric constant of the epoxy adhasive film is 5.66, the thermal conductivity is 0.581 W/（m·K）, the bonding strength is 36.99 MPa, the Tg is 174.77 ℃, and the solder resistance time is 10 min.

关 键 词：环氧胶膜 耐焊性 介电性能 导热性能 

分 类 号：TM215.3[一般工业技术—材料科学与工程]