DMH对丁二酰亚胺无氰镀银的影响  

The impact of DMH on Succinimide Cyanide-free Silver Plating

作　　者：杨晨[1] 刘定富[1] 

机构地区：[1]贵州大学,贵州贵阳550025

出　　处：《电镀与精饰》2015年第3期28-31,共4页Plating & Finishing

摘　　要：将5,5-二甲基乙内酰脲(DMH)加入丁二酰亚胺镀银溶液中,考察了DMH的添加量对镀银层外观、光泽度、镀液阴极电流密度上限及沉积速度的影响,采用扫描电镜观察镀层的微观形貌。结果表明,当DMH质量浓度为20 g/L时,可获得结合力、抗变色能力良好,光泽度为232 Gs的镀银层,Jκ上限为0.76 A/dm2,沉积速率为1.263 g/(dm2·h)。5,5-dimethyl hydantoin （DMH） was added into succinimide cyanide-free sliver plating solu- tion, and influences of DMH dosage on appearance and gloss of the silver coating, upper limit of cathode current density,and deposition speed were investigated. Coating morphology was observed by scanning e- lectron microscopy （SEM）. Results showed that when DMH mass eoncentration was 20 g/L, the silver coating, with good binding force, good anti-tarnishing ability and 232 Gs gloss, could be obtained. The up limit of cathode current density was 0. 76 A./dm： and the deposition rate was 1. 263 g/（dm2 · h）.

关 键 词：无氰镀银 丁二酰亚胺 5 5-二甲基乙内酰脲 结合力 抗变色能力 

分 类 号：TQ153.16[化学工程—电化学工业]