基于Flotherm的电子电路热仿真分析与研究  

Thermal simulation analysis for Electronic circuit on Flotherm

作　　者：钮冬科[1] 金晓怡[1] 张向伟[1] 周强[1] 

机构地区：[1]上海工程技术大学机械工程学院,上海201620

出　　处：《现代电子技术》2015年第6期16-19,24,共5页Modern Electronics Technique

基　　金：两层升降横移式一体停车设备的机械设计(JX-017)

摘　　要：在阐述电子设备热仿真分析重要性的同时,简单介绍了电子设备传热类型,并对热分析软件的基本理论进行解析。介绍了热分析软件Flotherm的功能特点及应用范围,并以教学机器人PCB控制板为研究对象,用Flotherm软件对其电子电路进行热仿真分析,详细讲述了计算模型的建立、边界条件设置、网格划分、结果分析及优化处理等操作。通过仿真分析数据与实验结果比较,发现热仿真分析存在一定误差,分析研究误差存在的主要因素,提出通过优化操作的方法减小误差,达到较高的热分析精度,满足使用需求。While expounding the importance of the thermal simulation analysis for the electronic equipment,the heat con？duction types of the electronic equipments are introduced briefly and the basic theory of thermal analysis software is analyzed. The functions and application range of thermal analysis software Flotherm are introduced. Taking the PCB control board of the teaching robot as research objects,Flotherm is used to do the thermal simulation analysis for electronic circuit. The specific operations of computing model establishment,boundary condition setting,mash generation,result analysis and optimization pro？cessing are elaborated. A certain error existing in the thermal simulation analysis was found by contrasting the experimental re？sults with the simulation analysis data. The major factors that cause the error are analyzed. The optimization procedures are pro？posed to reduce the error,reach the high thermal analysis accuracy and meet the application requirements.

关 键 词：机器人 热仿真分析 FLOTHERM 误差分析 

分 类 号：TN710-34[电子电信—电路与系统]