超厚铝基板焊接工艺研究  

Research on welding technology for super thick aluminum substrate

作　　者：谭小鹏[1] 

机构地区：[1]中国电子科技集团第二十研究所,陕西西安710068

出　　处：《现代电子技术》2015年第6期39-40,43,共3页Modern Electronics Technique

摘　　要：超厚铝基板是一种特殊印制板，其具有良好的稳定性和导热性，逐渐被应用于军用设备和高科技民品领域。而其良好的导热性给焊接带来了困难，手工焊接在国军标规定的烙铁温度280~320℃限制下，已无法完成焊接。这采用一种新型的加热方式，补偿铝基板在焊接过程中的热损失，通过工艺试验寻找最佳的工艺参数，解决铝基板难以焊接的问题。The super thick aluminum substrate is a kind of special printed？circuit board,which has good performance in size stability and heat conduction,and has been gradually used in the fields of military equipment and high？tech civil product, but its good heat conduction brought about difficulty of welding. It means that the manual welding under the limitation of electric iron temperature （280~320℃） prescribed by the military standard,is unable to complete the welding. A new type of heating mode is adopted in the welding process to compensate heat loss of aluminum substrate,find the best process parameters by means of technological test,and solve the welding problem.

关 键 词：铝基板 预热板 手工焊接 热补偿 

分 类 号：TN710-34[电子电信—电路与系统]