毫米波多芯片组装工艺优化研究  

Process Optimization of Multi-chip-assembly of Millimeter Wave Interconnection

作　　者：任榕[1] 宋夏[1] 邱颖霞[1] 解启林[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子工艺技术》2015年第2期76-78,共3页Electronics Process Technology

基　　金：国防基础科研重点项目(项目编号:A1120132016)

摘　　要：随着毫米波系统对模块小型化集成化的需求日益增长,多芯片组装工艺技术成为毫米波模块互连的关键手段。分析了芯片组装工艺的特点,同时基于毫米波MMIC芯片组装工艺要求,通过射频互连芯片组装间隙工艺设计保证、共晶焊接钼铜载体结构优化设计以及自动点胶粘片参数优化研究,给出了相应的优化设计措施,从而达到MMIC芯片组装工艺优化的目的。With the increasing requirements of miniaturization and high integration of the millimeter-wave system modules, multi-chip-assembly has become the key technology in the interconnection of millimeter wave modules. The characteristics of chip assembly process were analyzed. Based on the technological requirements of chip assembly of millimeter wave interconnection, optimum processes such as slit width control of RF chip assembly, structural design optimization of Mo-Cu heat sink; automatic dispensing parameter and mounting parameter optimization were proposed in details. And then the optimum performance was obtained for MMIC chip assembly process.

关 键 词：多芯片组装 毫米波互连 工艺优化 

分 类 号：TN605[电子电信—电路与系统]