数字处理器SiP封装工艺设计  

Technology Design of System in Package of Digital Processor Module

作　　者：李悦[1] 

机构地区：[1]西南电子设备研究所,四川成都610036

出　　处：《电子工艺技术》2015年第2期86-88,93,共4页Electronics Process Technology

基　　金：国防科工局技术基础"十二五"科研项目

摘　　要：由于系统小型化要求,数字处理分机由原来的机箱缩小为一个表贴器件。通过选用裸芯片采用SIP封装的形式,把集成电路ADC芯片、ASIC、存储芯片和各类无源元件如电容、电感等集成到一个多层基板上。以现有混合集成技术为基础,主要研究器件装配工艺选择,对于关键器件,采用电磁仿真软件模拟装配方式对性能的影响。通过有限元仿真,分析芯片的散热需求;并详细探讨了基板材料对封装器件散热的影响。Digital Processor Module becomes to be a device from an extension box due to the requirements of system miniaturization. Bare chip devices with different functionality, like ADC, ASIC, flash, capacitor, inductor, are assembled into a multilayer substrate by technology of System in Package, and formed into a single standard package that provides multiple functions associated with a system. Mainly study the choice of assembly technology based on existing hybrid integrated technology. Imitate the impact of assembly method on performance through electromagnetic simulation software. Analyze the cooling demand of chip through the finite element simulation. Discuss the impact of substrate material on heat dissipation of encapsulated device in detail.

关 键 词：封装工艺 仿真 封装基板 

分 类 号：TN605[电子电信—电路与系统]