低温条件下光学厚度对Tm^(3+):YAG材料光谱烧孔孔深的影响（英文）  

Spectral hole depth dependence on optical length in Tm^(3+):YAG within cryogenic temperature range

作　　者：马秀荣[1,2,3] 王夏洋 

机构地区：[1]天津理工大学计算机与通信工程学院光电器件与通信技术教育部通信研究中心,天津300384 [2]天津理工大学电子信息学院 [3]天津理工大学薄膜电子与通信器件重点实验室,天津300384

出　　处：《红外与激光工程》2015年第3期964-968,共5页Infrared and Laser Engineering

基　　金：天津市科技创新专项基金(10FDZDGX00400)

摘　　要：通过理论与实验研究了光学厚度对Tm3+:YAG材料光谱烧孔孔深的影响。提出了一种用于分析光学厚度对光谱烧孔孔深影响的新模型。该模型从理论上推导了烧孔孔深与光学厚度的关系。根据提出的理论模型,当温度大于4 K时,通过选择合适的光学厚度可以使光谱烧孔孔深得到最大值。最后通过使用合适的激光与Tm3+:YAG材料所形成的光谱烧孔实验证明了实验结果与理论分析是相一致的。Spectral hole depth dependence on optical length in Tm^3＋：YAG was theoretically and experimentally investigated. A novel model was proposed to analyze the spectral hole depth dependence on optical length. With the proposed model, the spectral hole depth dependence on optical length had been derived theoretically. According to the theoretic result, when temperature was higher than 4 K, the maximum spectral hole depth could be found by choosing the optimum optical length. The theoretical analysis were experimentally tested using spectral hole burning in Tm^3＋：YAG for a couple of configurations and sizes of the beams.

关 键 词：光谱烧孔孔深 光学厚度Tm^3+:YAG 温度 

分 类 号：TP911.73[自动化与计算机技术]