单线切割设备的切割方式研究  

The Study On The Cutting Of Single Wire Saw Equipment

作　　者：王欣[1] 衣忠波[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2015年第1期9-13,共5页Equipment for Electronic Products Manufacturing

摘　　要：通过对两种单线切割方式(摆动切割和不摆动切割)切割线受力情况的分析,比较了切削线与工件之间的接触长度与受力状态,以提高晶片切割表面质量和切片效率并减小切削线断线率的切割方式为研究方向,通过理论分析和实际应用得出:摆动切割时切削线与工件的接触长度较小,法向压力和切向切割力会更小,所以切削线不容易断裂;承载着工件的工作台的弧形摇摆也促进了切割运动,而且与切割运动同步还可以保证对切割面有一个合理的研磨作用,也使得切削粉末可以更容易排出,有效提高切割表面质量。Through the analysis of the cutting line mode force of two kinds of single wire cutting（swing cutting and not swing cutting）,Comparison of the contact length between the cutting wire and the workpiece and the stress state,In order to research to improve the wafer cutting surface quality and efficiency of slicing and reducing the cutting line break rate cutting way for direction,Through theoretical analysis and practical application of results ：Contact length of cutting wire and the work piece is small when the swing cut,Normal pressure and shear force will be smaller to cut,So cutting line is not easy to break;Carrying the work piece table also contributed swing arc cutting movement,And with a cutting motion synchronous cutting surface can also ensure a reasonable abrasive,Also makes it easier to cut powder discharge,Effectively improve the quality of the cut surface.

关 键 词：半导体设备 单线切割 直线进给切割 摆动切割 摆动工作台装置 

分 类 号：TN305.1[电子电信—物理电子学]