金刚石焦磷酸盐镀铜工艺优化  

Optimization of electroplating Cu&Ni onto diamond

作　　者：曹河周 郭松[1] 

机构地区：[1]河南黄河旋风股份有限公司,河南长葛461500

出　　处：《金刚石与磨料磨具工程》2015年第2期66-68,共3页Diamond & Abrasives Engineering

摘　　要：为分析焦磷酸盐电镀铜出现漏镀的原因,并提出相应的解决方法,采用化学镀的方法在金刚石表面预镀一层镍,然后通过电镀铜加厚。实验表明:预镀过程中并无漏镀,镍层是在加厚的过程中溶掉了。进一步实验验证表明:其原因在于金属镍与铜盐发生了置换反应。为解决这一问题,提出了加大电流和预镀铜两种方案,二者均能大幅改善漏镀现象,但各有优劣。A series of experiments were conducted to optimize the process of electroplating Cul＆Ni onto diamond and solve the problem of Ni leakage. Results showed that after preplating, the diamond wastotally covered by Ni, which just melted during following plating process. Further experiments indicated the reason, which was a displacement reaction between Cu and Ni. To solve this problem,two projects, namely to increase current and to preplate Cu, were proposed. It turned out that both projects worked, while each of them had its own advantages and disadvantages.

关 键 词：金刚石 电镀铜 漏镀 

分 类 号：TQ164[化学工程—高温制品工业]