添加剂丁基黄原酸对碱性羟基乙叉二膦酸体系电沉积铜的影响  

Influence of Butyl Xanthate Additives on Electrodeposition Behavior of Copper in Alkaline Plating Bath Containing 1-Hydroxyethylene-1,1-diphosphonic Add Complexing Agent

作　　者：黄发军[1] 曾冬铭[1] 刘中兴 

机构地区：[1]中南大学化学化工学院,湖南长沙410083 [2]特能宝化学原料有限公司,广东佛山528251

出　　处：《材料保护》2015年第4期23-26,7,共4页Materials Protection

摘　　要：过去有关丁基黄原酸添加剂对铜电沉积行为和电极过程影响的研究还不够。采用线性电位扫描(LSV)、计时电流(CA)、交流阻抗和Tafel极化曲线等电化学方法并结合金相显微镜,研究了添加剂丁基黄原酸的浓度对碱性HEDP(羟基乙叉二膦酸)体系镀铜电沉积过程的影响。结果显示:丁基黄原酸在阴极具有一定的吸附能力,对铜沉积有阻化作用,且丁基黄原酸浓度越大,阻化作用越强;铜电沉积的初期行为服从扩散控制和三维连续成核方式生长规律;丁基黄原酸能提高镀液的微观分散能力,使得镀层光滑而平整。The influence of butyl xanthate additive on copper electrodeposition in alkaline electrolyte containing 1-hydroxyethylene-1,1- diphosphonic acid(HEDP) complexing agent was investigated by linear sweep voltammetry and chronoamperometry in association with measurement of electrochemical impedance spectra and Tafel polarization curve as well as metallographic microscopic observation.Results indicated that butyl xanthate,with strong adsorption capacity on cathode,inhibited copper electrodeposition in the alkaline bath,and its inhibition efficiency tended to rise with the increase of concentration.Besides,the electrodeposition behavior of Cu at the initial stage was dominated by diffusion control and three- dimensional progressive nucleation growth.Moreover,the butyl xanthate additive was able to increase the microcosmic dispersibility of the electrolyte and the smoothness and compactness of Cu coating.

关 键 词：碱性镀铜 添加剂 丁基黄原酸 HEDP 电化学方法 电沉积行为 作用机理 

分 类 号：TQ153.14[化学工程—电化学工业]