聚合物基复合封装材料导热性能的参数仿真  

Parametric Simulation of the Thermal Property of Polymer-based Composite Packaging Materials

作　　者：王文志[1] 郑鹏[1] 周继军[1] 郑梁[1] 秦会斌[1] 

机构地区：[1]杭州电子科技大学新型电子器件与应用研究所,杭州310018

出　　处：《电子与封装》2015年第4期1-4,共4页Electronics & Packaging

基　　金：国家自然科学基金(51302056);浙江省教育厅基金(Y201017252);浙江省公益性技术应用研究计划(2013C31064)

摘　　要：鉴于聚合物基复合封装材料导热性能传统研究方法的不足(效率低、预测模型不合理等),提出了一种基于VC++结合ANSYS和MATLAB联合编程的方法,对聚合物基复合材料的导热性能进行参数化有限元分析。用户只需要在由VC++开发出来的人机交互界面上输入复合材料的相关导热参数,即可由ANSYS与MATLAB相互协作完成导热模型的构建、模型导热率的数值仿真、结果输出的可视化处理等一系列工作。通过分析氮化铝填充环氧树脂复合材料的导热性能,检验了该方法的可靠性。研究结果表明,该方法不仅能够有效地预测实验结果,而且还方便易用。In view of the shortcomings of traditional methods in the thermal conductive research of polymer-based composite packaging materials （low efficiency, unreasonable prediction model, etc.）, a parameter finite element analysis method using programming VC＋＋, ANSYS and MATLAB is introduced. Researcher could input the related parameter of composite on the interactive interface developed by VC＋＋. ANSYS and MATLAB are employed to complete the construction of thermal conducting model, the calculation of thermal conductivity and the output of visual processing. The thermal properties of AlN filled expoxy were studied using this program and compared with the experimental results. The results showed that this method could exactly predict the experimental results and were easy to use.

关 键 词：ANSYS 导热复合材料 VC++ 有限元分析 

分 类 号：TP399[自动化与计算机技术—计算机应用技术]