抗静电聚酰亚胺薄膜材料的研究进展  

Research Progress of Antistatic Polyimide Film Materials

作　　者：陈志平[1] 黄孙息[1] 白小庆[1] 青双桂[1] 

机构地区：[1]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2015年第5期6-9,共4页Insulating Materials

摘　　要：聚酰亚胺因其良好的绝缘性能使得材料表面容易产生静电,静电的积累会引起燃烧、爆炸等危险,因此如何消除其表面静电是人们长期以来探索的重要课题之一。本文主要介绍了静电产生的机理、静电带来的危害及其危害机理,综述了碳系、金属及金属氧化物系、导电高分子系及离子注入改性4类抗静电聚酰亚胺薄膜的研究进展,并展望了抗静聚酰亚胺薄膜未来的发展趋势。Polyimide is easy to produce electrostatic because of its excellent insulating property, and the accumulation of electrostatic may lead to combustion and explosion, thus how to eliminate the surface electrostatic is one of the important subjects for a long time. The generation mechanism of electrostatic, and damage brought by electrostatic and damage mechanism were intruduced mainly. The research prog- ress of antistatic polyimide film materials modified by carbon, metal and metallic oxide, conductive filler, and ion implantation was summarized, and their future prospects were proposed.

关 键 词：聚酰亚胺 抗静电 导电填料 离子注入技术 

分 类 号：TM215.3[一般工业技术—材料科学与工程]