稀释剂含量对低温固化型导电银浆及其固化膜性能的影响  

Effect of diluent content on properties of low temperature curable conductive silver paste and its cured film

作　　者：戈田田[1] 甘卫平[1] 周健[1] 黎应芬[1] 鲁志强[1] 杨超[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《电镀与涂饰》2015年第10期542-548,I0002,共8页Electroplating & Finishing

摘　　要：借助黏度测试仪、扫描电镜及红外光谱、非等温差示扫描量热法等分析手段,通过测量体积电阻率、附着力和硬度,探讨了以糠醛–丙酮作为E-51环氧树脂/双氰胺体系导电银浆的活性稀释剂时,稀释剂含量对体系黏度及所得导电膜断面形貌、机械性能和导电性的影响。另外讨论了固化时间对导电膜导电性的影响。结果表明:随稀释剂含量增加,银浆的黏度迅速下降,稀释剂含量为25.0%时,黏度下降了87.5%;综合考虑银浆的固化程度、丝网印刷效果、导电性和机械性能,选择稀释剂含量为12.0%,此时所得导电膜性能最佳:固化最完全,体积电阻率最小(1.33×10^(-5)Ω·cm),导电性最好,硬度5H,附着力4B。根据动力学分析,最佳固化温度为148.33°C,该固化反应级数是0.79,反应活化能为27.51 k J/mol。Furfural-acetone was used as reactive diluent for E-51 epoxy resin/dicyandiamide system conductive silver paste. The effect of diluent content on viscosity of the low temperature curable silver paste as well as section morphology, mechanical properties, and electrical conductivity of its film was discussed with the help of viscometer, scanning electron microscope, infrared spectroscope, non-isothermal differential scanning calorimeter and by testing volume resistivity, adhesion strength, and hardness. The influence of curing time on conductivity of the cured film was examined. The results showed that the viscosity of silver paste declines sharply with increasing amount of diluent. The viscosity is decreased by 87.5% when the diluent content is 25.0%. Taking comprehensive account of silver paste＇s curing degree, screen printing performance, conductivity, and mechanical properties, the diluent amount is determined to be 12.0%, with which the performances of the film obtained is optimal, as shown by the maximum curing degree, minimum volume resistivity （1.33 × 10-5 Ω.cm）, the best conductivity, adhesion strength 4B, and pencil hardness 5H. According to kinetic analysis, the optimal curing temperature is 148.33 ℃, reaction order is 0.79, and reaction activation energy is 27.51 kJ/mol.

关 键 词：糠醛 丙酮 导电银浆 黏度 导电性 机械性能 固化反应动力学 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]