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作 者:宁洪龙[1,3] 胡诗犇 朱峰[1] 姚日晖[1] 徐苗[1] 邹建华[1] 陶洪[1] 徐瑞霞 徐华[1] 王磊[1] 兰林锋[1] 彭俊彪[1]
机构地区:[1]华南理工大学材料科学与工程学院,高分子光电材料与器件研究所,发光材料与器件国家重点实验室,广州510640 [2]新视界光电技术有限公司,广州510530 [3]中国科学院红外物理国家重点实验室,上海200083
出 处:《物理学报》2015年第12期65-71,共7页Acta Physica Sinica
基 金:广东省引进创新科研团队计划(批准号:201101C0105067115);中国科学院红外物理国家重点实验室开放课题(批准号:M201406);国家自然科学基金(批准号:61036007,51173049,61306099,61401156,61204089);中央高校基本科研业务费专项资金(批准号:2014ZZ0028);广州市科技计划(批准号:2013Y2-00114)资助的课题~~
摘 要:在铜(Cu)和非晶铟镓锌氧化物(a-IGZO)之间插入30 nm厚的钼(Mo)接触层,制备了具有Cu-Mo源漏电极的a-IGZO薄膜晶体管(TFT).Mo接触层不仅能够抑制Cu与a-IGZO有源层之间的扩散,而且提高了Cu电极与玻璃基底以及栅极绝缘层的结合强度.制备的Cu-Mo结构TFT与纯Cu结构TFT相比,具有较高的迁移率(~9.26 cm2·V-1·s-1)、更短的电流传输长度(~0.2μm)、更低的接触电阻(~1072Ω)和有效接触电阻率(~1×10-4Ω·cm2),能够满足TFT阵列高导互联的要求.Copper is an alternative material for aluminum electrode to meet the stringent requirement for high mobility and low resistance-capacitance (RC) delay of amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistor (TFT) for next generation of display technology due to its intrinsic high conductivity. However, low bonding strength between copper layer and insulator/glass and easy diffusion into active layer restrict its application in the field of TFT. In this work, a 30 nm thin film of molybdenum is introduced into copper electrode to form a copper-molybdenum source/drain electrode of a-IGZO TFT, which not only inhibits the diffusion of copper, but also enhances the interracial adhesion between electrode and substrate. The obtained Cu-Mo TFT possesses a high mobility of ~9.26 cm^2·V^-1·s^-1 and a low subthreshold swing of 0.11 V/Decade. Moreover, it has shorter current transfer length (-0.2μm), lower contact resistance (-1072Ω), and effective contact resistance (~1×10^-4Ω·cm^2) than the pure copper electrode. Cu-Mo electrode with low contact resistance and high adhesion to substrates paves the way to the application of copper in high conductivity interconnection of a-IGZO TFT.
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