基于剥离工艺的晶圆材料表面形貌表征  

Characterization of Surface Morphology of Piezoelectric Wafer Material Based on Lift-off Technique

作　　者：刘善群[1] 喻卫兵[1] 赵雪梅[1] 陶玲[1] 陆川[1] 

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《压电与声光》2015年第3期512-514,518,共4页Piezoelectrics & Acoustooptics

摘　　要：压电晶圆表面形貌特征参数是影响光刻剥离工艺及器件批生产成品的关键技术基础。基于声表面波(SAW)器件剥离工艺,该文提出并量化了晶圆材料表面形貌表征参数体系:翘曲度(BOW)、平坦度(GBIR)、小区平坦度(SBIR)、小区平坦度合格率(PLTV)等,并给出了晶圆材料表面形貌表征参数的测试方法及对光刻工艺参数的影响。The characteristic parameters of the surface morphology of piezoelectric wafer are the key factors which can influence directly on the lift-off precision and the rate of finished products. The surface morphology characterizing parameter systems including the wafer bow, total thickness variation （TTV）, local thickness variation （LTV） and the percent local thickness variation （PLTV） were proposed and quantified based on lift-off technique in this work. The test method of the surface morphology characterizing parameters and its influence on the lithography technology was given. The proposed method could lay a key technology foundation for the batch-produced SAW devices and the development of high reliable SAW devices.

关 键 词：压电晶圆 表面形貌 表征 平坦度 

分 类 号：TN384[电子电信—物理电子学]