基于UMAC的倒装焊机运动控制系统  

UMAC Based The Motion Controlling System of Flip Chip Bonding Machine

作　　者：张永聪[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2015年第4期36-42,共7页Equipment for Electronic Products Manufacturing

摘　　要：倒装焊机主要实现焊料凸点和金凸点芯片在硅、陶瓷基板上的倒装焊接,其集精密运动控制、机器视觉、加热、加压等功能于一体,设备的运动控制系统,采用UMAC运动控制器,不但使硬件结构简化,而且解决了控制中高速、高精度运动控制问题,提高了系统的稳定性和可靠性。The flip chip bonding machine mainly be used in flip bonding of the solder point and gold point on the silicon or chinaware board, which obtains precision motion control, machine vision, heating, pressurization and other functions in the same time. The text mainly introduces the motion controlling system of flip chip bonding machine, which is based on UMAC motion controller. The application of UMAC can not only simplify the hardware structure, but also solve the control problem of high speed, high precision motion control and improve the stability and reliability of the system.

关 键 词：倒装焊机 UMAC 运动控制 

分 类 号：TN605[电子电信—电路与系统]