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机构地区:[1]西安交通大学材料科学与工程学院,西安710049 [2]西北有色金属研究院西安泰金工业电化学技术有限公司,西安710016
出 处:《电子与封装》2015年第6期9-12,共4页Electronics & Packaging
基 金:西安市2014年工业发展专项(GYZX14-02-12)
摘 要:"14针密排"玻璃-金属封接件在生产及应用过程中常会出现玻璃炸裂,继而引起元件封接强度、气密性、热稳定性及耐冲压性等综合性能降低甚至报废。结合其特殊的导电性能和气密性设计要求,分析认为玻璃产生微裂纹的原因是封接元件膨胀系数不相匹配。利用"环封"工艺逐级过渡玻璃和金属之间的膨胀系数差异,同时结合玻璃抗压不抗拉的特性,达到"匹配封接",彻底解决普遍存在于该类元器件中的致命问题。Cracks as the very bad defects always appear in the production and application of the 14-pin glass-to-metal seal, and for the result, the comprehensive performance such as sealing strength, air-tightness, thermal stability and stamping resistance will be reduced and even the element scrapped cause of it. Combining with its design requirements for special conductive and air-tightness performance, unmatched expansion coefficient have been regarded as the main reason causing micro cracks. Transition ring glass-to-metal technology have been used to reduce the expansion coefficient difference to get the matched glass-to-metal seal and solve such common problem in multi-pin glass-to-meal seal components in the paper.
分 类 号:TN305.94[电子电信—物理电子学] TG113.1[金属学及工艺—物理冶金]
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