合金元素Ag含量对Sn-Ag-Cu无铅焊料焊接性能的影响  

Effect of Ag concentration on soldering properties of Sn-Ag-Cu lead-free solder alloy

作　　者：高瑞军[1] 张宇航[1] 康宇[1] 韩振峰[1] 孙福林[1] 钟茂山 

机构地区：[1]广东省工业技术研究院(广州有色金属研究院),广东广州510650

出　　处：《材料研究与应用》2015年第2期112-115,共4页Materials Research and Application

摘　　要：探讨了合金元素Ag含量对Sn-Ag-Cu无铅合金焊料熔化温度、铺展性及润湿性的影响.结果表明,随着Ag含量的增加,Sn-Ag-Cu合金焊料的熔化温度降低,铺展性和润湿性提高,当w(Ag)≤0.5%时,Sn-0.7Cu焊料与Sn-0.5Ag-0.5Cu焊料的焊接性能十分接近.The paper has investigated that different amount of pure Ag are added into Sn-Ag-Cu lead-free solders,and the effect on soldering properties was also discussed. The results show that Ag can improve spreadability and wettability of Cu alloy further. When 0.5% of Ag added,both Sn-0.7Cu and Sn-0. 5Ag- 0.5Cu solder alloys exhibited similar properties.

关 键 词：无铅焊料 熔化温度 铺展 润湿 

分 类 号：TG11[金属学及工艺—物理冶金]