大功率半导体激光器载体设计  

Heat Sink Design of High Power Semiconductor Laser

作　　者：李雅静[1] 彭海涛[2] 

机构地区：[1]咸阳师范学院物理与电子工程学院,陕西咸阳712000 [2]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《光电技术应用》2015年第3期23-24,53,共3页Electro-Optic Technology Application

基　　金：咸阳师范学院专项科研基金(自然科学)资助项目(12XSYK016)

摘　　要：激光器工作时由于存在各种非辐射复合损耗和自由载流子吸收等损耗机制,使注入到器件中的部分电功率转换成热耗散在激光器内,直接影响激光器的效率和寿命,因此散热处理一直是一个引人注意的焦点。采用微通道载体解决大功率半导体激光器阵列连续工作时散热问题,通过ANSYS软件模拟优化结构参数,实验测得了大功率半导体激光器阵列热阻。When the laser diodes working, the losses of various non-radiating recombination and free carrier absorption are inevitable, so portion of the electrical power is converted into heat dissipation, which caused direct impact on the efficiency and lifetime of the laser. So the heat treatment has been a focus of attention. The micro channel heat sink is used to solve the problem of heat dispersing when the high power semiconductor laser array working, the structure parameters of the micro channel heat sink is optimized by using the ANSYS simulation soft-ware, and the thermal resistance of the high power semiconductor laser array is tested.

关 键 词：大功率半导体激光器 微通道热沉 散热技术 

分 类 号：TN248.4[电子电信—物理电子学]