柔性凸点热-结构耦合应力应变有限元分析  

FEA study on the stress and strain of solder joint with compliant layer based on thermal-structure coupling

作　　者：周兴金 黄春跃[1] 梁颖[2] 李天明[3] 邵良滨 

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004 [2]成都航空职业技术学院电子工程系,四川成都610021 [3]桂林航天工业学院汽车与动力工程系,广西桂林541004

出　　处：《电子元件与材料》2015年第7期82-87,共6页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.51465012);广西壮族自治区自然科学基金资助项目(No.2012GXNSFAA053234;No.2013GXNSFAA0193 22);四川省教育厅科研资助项目(No.13ZB0052)

摘　　要：建立了芯片尺寸封装焊点的柔性凸点三维有限元分析(FEA)模型,对该模型进行了热-结构耦合有限元分析,研究了热-结构耦合条件下柔性凸点温度场和应力应变的分布规律,对比了有无柔性层结构的凸点内应力应变的大小,分析了柔性层厚度、上下焊盘直径对柔性凸点应力应变的影响。结果表明:柔性层结构有效降低了凸点内的应力应变;随着柔性层厚度的增加,凸点内最大应力应变减小;随上焊盘和下焊盘直径的增加,凸点内最大应力应变的变化无明显规律。The 3D finite element analysis model of chip scale package solder joints with compliant layer was established, the thermal-structure coupling finite element analysis of the model was performed, the temperature field and stress and strain distribution of the solder joints with complaint layer were obtained under the condition of thermal-structure coupling, the stress and strain magnitude between the solder joints with complaint layer and the solder joints without complaint layer were compared, the influences of the thickness of compliant layers, the diameter thicknesses of up pad and down pad on the stress and strain of solder joints with compliant layer structure were studied. Results show that the compliant layer structure can reduce the stress and strain of solder joints effectively. With the increase thickness of compliant layer, the maximum stress and strain of the solder joints decrease. With the increase diameter of the up and down pad, the maximum stress and strain within the solder joints with complaint layer have no obvious regularity.

关 键 词：焊点 热-结构耦合 柔性层 焊盘直径 有限元分析 温度场 

分 类 号：TG404[金属学及工艺—焊接]