陶瓷绝缘子振动镀工艺研究  

The Research of Vibration Plating Technology on Ceramic Insulator

作　　者：路聪阁[1] 

机构地区：[1]中国电子科技集团公司第十三研究所第七专业部,河北石家庄050000

出　　处：《广东化工》2015年第11期71-72,共2页Guangdong Chemical Industry

摘　　要：陶瓷绝缘子尺寸非常小,其金属化图形电镀一直是个难题。采用传统手工捆绑式电镀,不仅存在绑印,漏镀等问题,且操作十分困难,生产效率极为低下。因此,对陶瓷绝缘子进行了振动镀工艺研究。文章主要对比了不同振动镀导电填料对镀层外观与均匀性的影响,并通过优化振动镀工艺,成功实现了陶瓷绝缘子的高效率、批量化电镀。The metal plating of ceramic insulator has been always a problem for the size of ceramic insulator is very small. Using traditional manual bundling technology will cause imprint, plating leakage, operation difficulty and tow efficiency. Therefore, we made a study of vibration plating technology on ceramic insulator. The paper mainly compares the effects of vibration plating using different conductive fillers on the appearance and uniformity. By optimizing the vibration plating technology, we managed to achieve a high efficiency and batch electroplating on ceramic insulator.

关 键 词：陶瓷绝缘子 振动镀 导电填料 

分 类 号：TQ[化学工程]