铜在电镀液中的腐蚀电化学行为  

Electrochemical corrosion behavior of copper in plating solution

作　　者：陶志华[1,2] 何为[1,2] 王守绪[1] 周国云[1] 肖定军 谭泽 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610054 [2]广东光华科技股份有限公司,广东汕头515000

出　　处：《中国科技论文》2015年第12期1382-1386,共5页China Sciencepaper

基　　金：高等学校博士学科点专项科研基金资助项目(20120185110021);中央高校基本科研业务费专项资金资助项目(ZYGX2013J032);广东省引进创新科研团队计划资助项目(201301C0105324342)

摘　　要：铜金属是实现电子元器件电气互联的关键材料,而铜金属在电子电镀酸性环境的作用下会发生铜腐蚀,可造成整个电子设备的提前失效。本文主要应用动电位极化曲线、电化学阻抗谱(EIS)对铜在电镀液中的腐蚀电化学行为进行了研究。结果表明,缓蚀剂环唑醇的缓蚀效果与其浓度相关,在电镀基础液介质中,当缓蚀剂浓度达到1mmol/L时,环唑醇对紫铜的缓蚀作用高达99%,同时能抑制铜腐蚀的阴、阳极反应过程,表明环唑醇是一种混合型缓蚀剂,铜的阻抗值随环唑醇浓度增加而增大,其在铜表面的吸附符合Langmuir等温式。Copper is the key material for electrical interconnection of electronic components.However,copper corrosion for metal copper can occur under the influence of electronic plating acidic environment,which can cause early failure of the entire electronic equipment.The corrosion electrochemical behavior of copper in plating solution was investigated using polarization curves and electrochemical impedance spectroscopy （EIS）.The results show that the inhibition performance of cyproconazole depends on the concentration of the inhibitor and the highest inhibition efficiency of cyproconazole reaches 99% at 1×10-3 mol/L in the base e-lectrolyte.The potentiodynamic polarization curves of copper in the base electrolyte clearly reveal that both cathodic and anodic processes of copper corrosion are suppressed,indicating cyproconazole is a type of mixed inhibitor.The resistance value of copper concentration increases with cyproconazole increase.Adsorption of inhibitor on the copper surface in the base electrolyte follows the Langmuir isotherm model.

关 键 词：缓蚀剂 动电位极化测定 铜腐蚀 交流阻抗谱 

分 类 号：TQ153[化学工程—电化学工业]