一种QFN封装器件焊接故障分析  

Welding Failure Analysis of One QFN Packaging Device

作　　者：田景玉[1] 孙守红[1] 刘剑[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,长春130031

出　　处：《航天制造技术》2015年第3期41-43,52,共4页Aerospace Manufacturing Technology

摘　　要：结合工程实践,介绍了QFN封装器件的优点和结构特点,从印制电路板裸板制板工艺、装联工艺两方面分析了一种QFN器件产生故障的原因,并给出了解决办法。通过改变制板工艺、改进网板设计等手段,有效解决连焊等问题并增强元器件的装联可靠性。介绍了其返修过程中应注意的工艺问题,并给出了QFN器件的可靠装联工艺。Combining with the actual project,the merit of the QFN device and its characteristic are introduced.The reason for the failure of one QFN packaging device is analyzed and solutions are given from the techniques of PCB manufacture and assembly.Through improving PCB techniques and stencil design,the problem of QFN assembly can be solved.At last,the repair technology is introduced and the assembly technology of QFN device is recommended.

关 键 词：QFN 焊接故障 网板设计 

分 类 号：TN41[电子电信—微电子学与固体电子学] TG441.7[金属学及工艺—焊接]