一种无卤高Tg高耐热覆铜板的制备  

Preparation of a high Tg, high heat resistance, and halogen-free Copper Clad Laminate

作　　者：奚龙[1] 王碧武[1] 何岳山[1] 

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2015年第2期34-37,共4页Printed Circuit Information

摘　　要：无卤中Tg覆铜板已成为主流的覆铜板产品,但市场对无卤高Tg高耐热覆铜板的期望也越来越强烈。本文制备了一种无卤高Tg高耐热覆铜板,该材料的Tg(DMA)>190℃,耐热性优异,Td(5%loss)>400℃,T300(带铜)>30min;并具有优异的粘结性能、优异的加工性能和低的CTE、极低的吸水率。The mid-Tg halogen-free copper clad laminate（CCL） has become the popular product. The expectation for high Tg, high heat resistance CCL is growing strongly. In this paper, a halogen-free, high Tg and, high heat resistant CCL has been developed. This laminate reaches a Tg（DMA）〉190℃, has outstanding heat resistance with, Td（5% loss）〉400℃, T300（with copper） 〉30min, and shows high adhesion, good mechanical performance, low coefficient expansion and very low water absorption as well.

关 键 词：无卤 高Tg 高耐热 覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]