PCB组件水清洗工艺技术研究  

Study on Aqueous Cleaning Technology for PCB Assembly

作　　者：林小平[1] 付维林[1] 

机构地区：[1]四川九洲电器集团有限责任公司,四川绵阳621000

出　　处：《电子工艺技术》2015年第4期228-230,237,共4页Electronics Process Technology

摘　　要：通过对水清洗工艺技术的研究,掌握水清洗工艺的方法,使PCB组件水清洗后达到国军标的要求。采用试验元器件、PCB、清洗剂以及焊接辅材组装水清洗样件,经过大量的水清洗试验,对清洗时间、清洗温度、漂洗次数、清洗剂体积分数对清洗效果的影响进行研究,水清洗后按标准要求进行目视检查以及残留离子含量检测,最终得出合适的水清洗工艺参数及清洗剂。Learn the methods of aqueous cleaning process based on the study of aqueous cleaning technology in order to make the PCB assembly reach the requirement of military standards after cleaning. Assembly samples with test component, PCB, detergent and solder materials, make aqueous cleaning experiments based on different washing time, temperature, rinsing times and concentration of detergent. Check the assemblies with visual inspection and measurement of ion concentration after cleaning. Finally got the suitable aqueous cleaning process parameters and cleaning detergent.

关 键 词：助焊剂 水清洗工艺 离子含量 

分 类 号：TN605[电子电信—电路与系统]