动态机械分析仪(DMA)表征无铅兼容覆铜板Tg的研究  

Study on dynamic mechanical analyzer for characterization of lead-free compatible copper clad laminate Tg

作　　者：黄晨光[1] 黄伟壮[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《印制电路信息》2015年第8期42-44,48,共4页Printed Circuit Information

摘　　要：DSC为业界评判覆铜板材料Tg的通用方法,但随着无铅覆铜板产品中填料比例增加和交联固化度提高,DSC法Tg曲线存在拐点不明显导致结果不准确问题。通过对比DMA与DSC测试原理和DMA法测量系统分析,结果表明对于含填料、PN固化的无铅兼容覆铜板采用DMA测试Tg的稳定性与重现性更好,更能准确地表征板材Tg。DSC is the universal method of CCL to evaluate the curing degree, but with increase of the content of filler and improved curing degree, the inflection point of Tg curve of DSC is not obvious result in Tg inaccurate. Through the comparison of DMA and DSC testing principle and DMA measurement system analysis, the results show that for the filler containing PN curing of lead-free compatible CCL with better stability and more accurate characterization of Tg with DMA.

关 键 词：动态机械分析仪 差示扫描量热仪 无铅兼容覆铜板 玻璃化转变温度 

分 类 号：TN41[电子电信—微电子学与固体电子学]