新型微光成像器件及应用  

The New Low Light Level Imaging Devices and It's Applications

作　　者：刘智超 樊桂花 郭惠超 范有臣 

机构地区：[1]装备学院研究生院,北京101416 [2]装备学院光电装备系,北京101416

出　　处：《红外技术》2015年第8期701-706,共6页Infrared Technology

基　　金：国家863计划;编号:2014AA7031024H

摘　　要：采用全固态微光成像器件是未来微光成像的发展趋势。介绍了2种全固态微光器件EMCCD、InxGa1-xAs,分析了其成像性能,描述了其研究现状,对比了传统的真空光电成像与全固态微光成像性能指标,阐明了微光成像器件向着高灵敏度、低噪声、宽光谱响应和强适应能力方向发展。All-solid-state imaging device is the future trend of low light level imaging. The paper introduces two types of all-solid-state imaging devices, provides an analysis of its imaging performance, description of research status, and comparison with conventional vacuum optical imaging device. It shows the new development direction of all-solid-state low light level imaging device will go towards high sensitivity, low noise, broad spectral response and strong adaptability.

关 键 词：微光成像 全固态微光成像器件 EMCCD INXGA1-XAS 

分 类 号：TN223[电子电信—物理电子学]