Ag-Pd端电极分离失效分析案例研究  

Failure Analysis Case of the Seperation of Ag-Pd Electrode

作　　者：钱雨鑫 姚宏旭[1,2] 楼倩[1,2] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610 [2]宁波赛宝信息产业技术研究院有限公司,浙江宁波315040

出　　处：《电子产品可靠性与环境试验》2015年第4期18-21,共4页Electronic Product Reliability and Environmental Testing

摘　　要：以压敏电阻为研究对象,探讨了电阻的可焊端与本体发生分离的原因。结果表明,在焊接的过程中,Ag-Pd端电极中的Ag与焊料中的Sn会形成低熔点合金物质,从而导致了可焊端与本体发生分离。因此,建议在焊接电阻的本体和Ag-Pd镀层端子的过程中,使用导电胶粘结工艺,以防止焊接过程中,Ag在高温下与焊料中的Sn反应而影响焊接的质量。Taking varistor as research object, the reason why the body and the welding end of the varistor seperate with each other during wehting process is discussed. The result shows that the reason of the seperation is that the Ag in the Ag-Pd electrode reacts with the Sn in the sohter during welding process. Therefore, in order to prevent Ag reacting with Sn and guarantee the quality of the welding, the conductive adhesive bonding process is suggested to be adopted when welding the Ag-Pd electrode and the body of a resistor.

关 键 词：银-钯端电极 失效分析 溶蚀 扫描电镜 能谱 

分 类 号：TM54[电气工程—电器] TM507