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机构地区:[1]工业和信息化部电子第五研究所华东分所,江苏苏州215011 [2]工业和信息化部电子第五研究所,广东广州510610
出 处:《冶金分析》2015年第8期34-38,共5页Metallurgical Analysis
基 金:科技部创新基金项目资助(13C26243202123)
摘 要:采用王水消解无铅焊料样品,基体匹配法绘制校准曲线消除基体干扰对测定结果的影响,建立了电感耦合等离子体原子发射光谱法(ICPAES)测定无铅焊料中银、铜、铅、铁、锌、镉、砷、铝、锑、铋、铟、镍等12种元素的方法。在选定的实验条件下,方法中各元素的检出限在0.0002~O.016μg/mL之间,各元素校准曲线线性相关系数均大于0.9995。按照实验方法测定样品,加标回收率为87%~125%,测定结果的相对标准偏差(RSD,n=6)在0.25%~5.1%之间,测定结果与参考值一致。The lead-free solder sample was dissolved with aqua regia.The calibration curve was prepared by matrix matching method to eliminate the influence of matrix interference on the determination results.The determination of twelve elements in lead-free solder(including silver,copper,lead,iron,zinc,cadmium,arsenic,aluminum,antimony,bismuth,indium and nickel)by inductively coupled plasma atomic emission spectrometry(ICP-AES)was established.Under the selected experimental conditions,the detection limits of elements were between 0.000 2μg/mL and 0.016μg/mL.The linear correlation coefficients of calibration curves of elements were higher than 0.999 5.The sample was determined according to the experimental method,and the recoveries of standard addition test were between 87%and 125%.The relative standard deviations(RSD,n=6)of determination results were between 0.25% and 5.1%.The found results were consistent with the reference values.
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