TO-252封装电磁仿真分析  

Analysis of the performance of PCB and bonding wire in TO-252 package

作　　者：刘崇辉[1,2] 任建伟[2] 李科[2] 杜寰[2] 金龙[1] 

机构地区：[1]电子科技大学电子科学技术研究院,四川成都611731 [2]中国科学院微电子研究所,北京100029

出　　处：《电子技术应用》2015年第9期48-50,59,共4页Application of Electronic Technique

摘　　要：随着工艺尺寸的缩小和工作频率提高,表面贴片式封装技术中的PCB板和键合线都可能对电路的电气特性产生影响,因此有必要对这种封装技术进行信号完整性的分析。文章介绍了一种表面贴片封装TO-252,采用3D电磁仿真软件HFSS进行建模,分析仿真PCB板材、厚度和键合线的长度、拱高、根数及键合线间的距离对封装设计中信号传输的影响,为实物封装设计起指导作用。With the reduction of process dimension and the development of working frequency, the packaging technology of PCB and bonding wire are likely to impact on the electrical characteristics of the circuit, it is necessary to analyze signal integrity of the packaging technology. This paper introduces a surface-mount package TO-252 and model it by using HFSS. There are some factors that have an impact on signal integrity of the package,such as the material and thickness of PCB, the length of bonding wire, the arch height of bonding wire, the distance between two adjacent bonding wire, the number of bonding wires. They play guiding roles in the physical package.

关 键 词：TO-252封装 PCB 键合线 信号完整性 

分 类 号：TN305.94[电子电信—物理电子学]