深亚微米工艺下SoC多点温度低功耗测试调度方法  

Multi-temperature and low power test scheduling method for SoC in deep submicron technology

作　　者：焦铬[1,2] 范双南 

机构地区：[1]湖南交通工程学院电气与信息工程系,衡阳421001 [2]衡阳师范学院计算机科学系,衡阳421002

出　　处：《电子测量技术》2015年第7期67-70,共4页Electronic Measurement Technology

摘　　要：在深亚微米技术实现的片上系统中,为了解决由于制程变异引起的温度不确定性,提出了一种多点温度测量的SoC低功耗测试调度方法。该方法采取在芯片中内建多个温度传感器,通过内建的温度传感器来感应温度,在SoC的核心部位进行多点采集,取温度的最高值反馈到控制系统,进行温度的调节控制。在测试过程中,在温度、功耗和总线带宽都满足条件的情况下进行调度,避免出现由制程变异引起的芯片局部过热的现象。在ITC’02基准电路上的实验结果表明,与文献[2]比较,该方法在保证芯片热安全的同时,使CPU使用时间平均多减少10.33%,使测试应用时间平均多减少11.14%。Systems on Chip implemented with deep submicron,in order to solve due to the temperature uncertainty induced by process variation,proposed a Multi-Temperature and Low Power Test Scheduling method.The method adopted to build multiple temperature sensor in the chip,through the temperature sensor to sense the temperature of the built-in,multi-point collection in the core part of SoC,the highest value of using temperature feedback to the control system,temperature regulation and control.The scheduling test satisfies a condition in the temperature,power consumption and bus bandwidth situation,avoid chip local overheating.Experimental results on ITC′02benchmark circuits show that,compared with the literature[2],the method can guarantee the chip thermal safety at the same time,the average CPU time decreased by more than 10.33%,the test application time average reduction of 11.14%

关 键 词：深亚微米工艺 多点温度 片上系统 低功耗测试调度 

分 类 号：TP391.7[自动化与计算机技术—计算机应用技术]